DESIGN OF A MOLD FOR FORMING COMPLEX 3D MEMS COMPONENTS

摘要

A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3D) mold; filling the 3D mold with filling material and removing the overburden filling material present on a top surface of the component.

主权项

1. A method of forming a mold structure having high-precision multi-dimensional components comprising:
depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of said oxide layers; repositioning said substrates to enable said oxide layers make contact with one another; bonding in sequential order said repositioned substrates using dielectric bonding, forming a three dimension (3D) mold; and filling said 3D mold with filling material and removing overburden of said filling material present on a top surface of said component.