发明名称 |
PLATING BATH COMPOSITION FOR IMMERSION PLATING OF GOLD |
摘要 |
The present invention relates to a cyanide-free aqueous immersion-type plating bath for deposition of gold, comprising gold ions, at least one complexing agent, sulfite ions, thiosulfate ions, and at least one ureylene polymer additive. The gold layer deposited from the plating bath according to the present invention shows a lemon-yellow colour and a sufficient wettability for tin based solder materials. |
申请公布号 |
WO2014026806(A3) |
申请公布日期 |
2014.08.28 |
申请号 |
WO2013EP64725 |
申请日期 |
2013.07.11 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
NIEMANN, SANDRA;SCHAFSTELLER, BRITTA;SCHULZ, JENNY;HABIG, ELLEN;BRUNNER, HEIKO;KOHLMANN, LARS;RÜCKBROD, SVEN |
分类号 |
C23C18/54 |
主分类号 |
C23C18/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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