| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device of a printed wiring board capable of enhancing productivity, and to provide a bonding method of a printed wiring board.SOLUTION: A bonding device of a printed wiring board comprises: a plate jig provided with one or more aperture; one or more flexible board mounted on the plate jig so that the position of the aperture substantially matches a planned bonding area, with one or more flexible board being laminated on the side opposite from the aperture; a block member for fixing the other board and the flexible board on which the other board is laminated, by pressing the other board; and a bonding head. Bonding is performed by abutting the bonding head against the planned bonding area through the aperture of the plate jig. |
