SELECTIVE LASER-ASSISTED TRANSFER OF DISCRETE COMPONENTS

摘要

Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

主权项

1. A method of transferring articles, comprising:
adhering an article to an adhesive layer of a laser-transparent carrier; focusing a low-energy laser beam through the laser-transparent carrier on a blistering layer in said carrier, which is proximal said adhesive layer, to form a blister in the blistering layer which deforms said adhesive layer; and transferring said article from said laser-transparent carrier to a receiving substrate placed in close proximity in response to separation of said article as the blister expands.