| 摘要 |
A cutting element comprising a polycrystalline diamond layer 58, a reduced coefficient of thermal expansion (CTE) substrate 53 comprising diamond particles disposed in a matrix material, wherein the diamond particles have a contiguity of 15% or less. Also independently claimed is a cutting element comprising a polycrystalline diamond layer, a reduced coefficient of thermal expansion substrate comprising matrix material, , at least one diamond filled region, and diamond particles embedded in the matrix material |
