Housing apparatus and method

摘要

A housing is described which comprises and inner layer and an outer layer. The outer layer comprises a material with a lower thermal conductivity than the inner layer. The outer layer is configured to have a thermal insulance sufficient to enable the housing to be touched comfortably in use, when the surface temperature of the housing is higher than body temperature. In one embodiment a receptacle for wireless communication components can be defined between the inner and outer layers, shielding the wireless communication components from interference from other components in the housing and allowing an antenna to be provided internal to the housing.