| 摘要 |
<p>A protective element that is capable of promptly reliably disconnecting a current path by taking advantage of the erosion phenomenon of a solder in a melted state. A plurality of electrodes (114) are formed by a first electrically conductive layer (112) deposited on a substrate (111) and by a plurality of second electrically conductive layers (113) spaced apart from one another in the in-plane direction of the substrate (111) on which the first electrically conductive layer (112) has been deposited. A solder paste (116) has a wetting performance for the electrodes (114) higher than that for the substrate (111) and is deposited on top of the first and second electrically conductive layers (112, 113) formed on the substrate. The solder paste melts by at least one out of heat generated by a resistor (103) and heat generated by a stack of the electrodes (114) and the solder paste (116) in such a manner that, as the solder paste erodes the portion of the first electrically conductive layer (112) intermediate between the electrodes (114), it is attracted towards the electrodes (114) exhibiting higher wettability by it than that of the substrate (111).</p> |
