发明名称 METHOD FOR FABRICATING SiC SUBSTRATE
摘要 A method for fabricating a SiC substrate using metastable solvent epitaxy comprises a Si evaporation step of evaporating a Si melt at an intermediate temperature between a SiC crystal growth temperature and a Si melting point after a crystal growth step of growing an SiC crystal with a predetermined film thickness on the surface of the SiC substrate at the SiC crystal growth temperature. In the method for fabricating the SiC substrate, the ambient pressure in the crystal growth step is higher than the saturated vapor pressure of the Si melt, and the ambient pressure in the Si evaporation step is lower than the saturated vapor pressure of the Si melt. Single-crystal SiC with no large irregularities on the surface thereof can be obtained by using the method.
申请公布号 EP2426238(A4) 申请公布日期 2014.08.27
申请号 EP20090844018 申请日期 2009.04.30
申请人 ECOTRON CO., LTD. 发明人 HAMADA, SHINKICHI;NAKAMURA, NOBUHIKO;MATSUNAMI, TORU
分类号 C30B19/04;C30B29/36 主分类号 C30B19/04
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