| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device high in connection reliability and high in design freedom in substrate design, and to provide a method for manufacturing the electronic device. SOLUTION: An electronic device includes: an electronic element 11 having electrodes formed on its main surface; an interposer substrate 12 having an interconnection pattern 12a formed on its one surface and the other surface including a pad electrode 16; and a mother board 18 including a pad electrode 19 on its one surface. The electrode of the electronic element 11 and the interconnection pattern 12a are electrically connected through a first bump 13 to form a connection part mounting the electronic element 11 on the interposer substrate 12 in a faced state. The connection part is sealed by a sealing resin 14, and the pad electrode 16 and the pad electrode 19 are electrically connected through a second bump 17 to form a connection part mounting the interposer substrate 12 on the mother board 18. The connection region between the electronic element 11 and the interposer substrate 12 is disposed between pitches of the pad electrode 16. COPYRIGHT: (C)2011,JPO&INPIT |
