PLATING MATERIAL AND ELECTRICAL AND ELECTRONIC COMPONENT USING THE PLATING MATERIAL

摘要

A plated material 5, containing: on a conductive substrate 1, an underlayer 2 composed of nickel and the like; an intermediate layer 3 composed of Cu or a Cu alloy being provided thereon; and an outermost layer 4 composed of a Cu-Sn intermetallic compound being provided thereon; and an electric or electronic part using the same.