| 摘要 |
<p>Method for realizing a dual interface IC card (50) comprising the steps of: arranging a plastic support (51) comprising a hole (56) or a recess, for housing a micro module (52); housing in the IC card an antenna (55) having at least one first and one second terminal or pad (p51, p52) of connection to the micro module (52) arranged in the recess (56); distributing a soldering paste on said at least one first and one second pad (p51, p52), so as to form a first and a second contact conductive bump (59a,59b) with electric connection contacts (c51, c52) of said micro module (52); distributing, along the whole perimeter of said micro module (52) or of said recess (56), a layer (58) of non conductive glue; positioning the micro module (52) in the recess (56) with the contacts (c51, c52) axially aligned to the terminal (p51, p52) of the antenna (55); executing a reflow of the soldering paste to form the first and the second conductive bump (59a, 59b).</p> |
