Method of manufacturing an array of optical devices

摘要

A method of manufacturing an array of optical devices by separating operational singlets 200 from a semiconductor wafer by forming a respective first diced surface and a respective second diced surface for each of the operational singlets, wherein the first diced surface is approximately orthogonal to the second diced surface. These are then arranged in close proximity to corresponding surfaces of other singlets in a receiving region of a submount 100. The receiving region of the submount is arranged such that the optical portions are aligned with a consistent separation distance between adjacent operational singlets. Then an epoxy 450 is applied at an intersection of the respective exposed surfaces of the singlets. The singlets are then mounted on an electronic module and then connected thereto to provide an optoelectronic module. One of the diced surfaces can be longer in a first direction than a second. One of the singlets can comprise an emitter and one can comprise a photosensitive semiconductor device.