| 摘要 |
The invention relates to a device for reflow soldering, which has at least one heat source, which is designed for heating up a solder material at least to a liquidus temperature, and which has at least one negative-pressure controlling device, which is designed for producing a negative pressure at least twice around the solder material during a time interval in which the solder material has a temperature that is greater than or equal to the liquidus temperature. |
