| 摘要 |
<p>The present invention provides a solution processing apparatus and a solution processing method capable of restraining a reverse flow of an exhaust gas flow to reduce mist reattaching to the substrate, even when the number of rotations of the substrate is increased and gas in the processing cup is exhausted at a low exhaust rate. A resist coating device for coating a resist solution on a wafer (W) which is rotated in the processing cup (33) formed with a downstream therein, includes an upper guide part (70) having an annual shape to surround the corresponding wafer (W) around a peripheral outer portion of the wafer (W) held and supported in a spin chuck (31) of the processing cup (33), and including an inner peripheral surface having a longitudinal-section shape curved to bulge outward and extending downward; and a lower guide part (45) including an inclined wall (41) inclined to an outer side downward from a lower portion of a peripheral portion of the wafer (W) and a vertical wall (42) vertically bulges downward followed by the inclined wall (41).</p> |
