Method for manufacturing an electronic device by reducing thickness of electronic members attached to a carrier

摘要

A method for manufacturing an electronic interconnect device is described, the method comprising: providing an electronic members each having one or more electrical contacts on a first member side thereof; providing a carrier having a carrier base and having sets of one or more electrically conductive projections on a surface of the carrier base; attaching the electronic members with the corresponding contacts thereof to the respective set of projections to thereby electrically connect the one or more electrical contacts of the respective chip with the corresponding one or more electrically conductive projections of the respective set; encapsulating exposed portions of the electronic member with an encapsulating material to form an encapsulation.

主权项

1. A method for manufacturing an electronic device, the method comprising:
providing a plurality of electronic members, each of the plurality of electronic members comprising one or more electrical contacts on a first member side; providing a carrier comprising a lower carrier base and an upper surface above the carrier base, wherein the upper surface comprises a plurality of electrically conductive projections and wherein the lower carrier base and the electrically conductive projections are of an one-piece structure; attaching the plurality of electronic members to the carrier with the first member side of each of the plurality of electronic members to the upper surface of the carrier, wherein at least one electrical contact of each of the plurality of electronic members is electrically connected to one of the plurality of electrically conductive projections; forming an encapsulation, comprising encapsulating one or more exposed portions of the plurality of electronic members with an encapsulating material; and reducing the thickness of each of the plurality of electronic members.