Integrated circuit packaging system with package-in-package and method of manufacture thereof

摘要

A method of manufacture of an integrated circuit packaging system includes: providing a package substrate, having a component side and a system side; mounting a first integrated circuit die on the component side of the package substrate; mounting a second integrated circuit die on the component side of the package substrate; mounting an internal package, having an internal die, over the first integrated circuit die; coupling chip interconnects between the first integrated circuit die, the second integrated circuit die, the internal die, the component side, or a combination thereof, and forming a stacked package body by encapsulating the component side, the first integrated circuit die, the second integrated circuit die, the internal package, and the chip interconnects.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a package substrate, having a component side and a system side; mounting an integrated circuit die on the component side of the package substrate; mounting a yet another integrated circuit die on the package substrate, the yet another integrated circuit die having the same size as the another integrated circuit die; mounting an another integrated circuit die on the component side of the package substrate over the yet another integrated circuit die; mounting an internal package with a wire in film adhesive over the integrated circuit die horizontally adjacent the another integrated circuit die, the internal package having an internal die, an internal package body, an internal package substrate having internal package contacts, and a further integrated circuit die on the internal package contacts, the internal package substrate coupled to the integrated circuit die, the another integrated circuit die, the further integrated circuit die, the internal die, the component side, or a combination thereof; coupling a chip interconnect directly connected to the another integrated circuit die and the internal package; coupling another chip interconnect directly connected to the internal package and the package substrate; and forming a stacked package body by fully encapsulating the component side, the integrated circuit die, the another integrated circuit die, the internal package, the chip interconnect, and the internal package contacts.