发明名称 |
Module structure with partial pierced substrate |
摘要 |
The present invention provides a module structure comprising a substrate with a partial pierced region. A main chip has a sensing area. At least one component is included, wherein the main chip, the at least one component and the substrate are located at the same level. A holder is disposed on the substrate. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area. |
申请公布号 |
US8816414(B2) |
申请公布日期 |
2014.08.26 |
申请号 |
US201213669055 |
申请日期 |
2012.11.05 |
申请人 |
LarView Technologies Corporation |
发明人 |
Jan Shin-Dar |
分类号 |
H01L31/062;H01L31/113;H01L31/0232 |
主分类号 |
H01L31/062 |
代理机构 |
Huntington IP Consulting Co., Ltd |
代理人 |
Yeh Chih Feng;Huntington IP Consulting Co., Ltd |
主权项 |
1. A module structure with a partial pierced substrate, comprising:
a first substrate, having a pierced region; a main chip, having a sensing area; at least one component, wherein said main chip and said at least one component are disposed on said pierced region of said first substrate, wherein said main chip, said at least one component and said first substrate locate at the same level; a first holder disposed on said first substrate; and a lens holder disposed on said first holder, and a lens configured on said lens holder, substantially aligning to said sensing area. |
地址 |
Yangmei, Taoyuan County TW |