发明名称 Multi-rack assembly with shared cooling unit
摘要 A multi-rack assembly is provided which includes first and second electronics racks. The first electronics rack includes one or more cooling units disposed within the first electronics rack, which are coupled in fluid communication with a primary coolant loop of the first electronics rack to, at least in part, provide cooled coolant to the primary coolant loop and facilitate cooling one or more first rack electronic components. The second electronics rack includes a secondary coolant loop coupled in fluid communication with the cooling unit(s) disposed within the first electronics rack. The multi-rack assembly further includes a controller to automatically provide cooled coolant to the secondary coolant loop, and wherein the controller controls flow of cooled coolant from the cooling unit(s) to the secondary coolant loop depending, at least in part, on cooling requirements of the first electronics rack.
申请公布号 US8817474(B2) 申请公布日期 2014.08.26
申请号 US201113285116 申请日期 2011.10.31
申请人 International Business Machines Corporation 发明人 Campbell Levi A.;Chu Richard C.;David Milnes P.;Ellsworth, Jr. Michael J.;Iyengar Madhusudan K.;Simons Robert E.
分类号 H05K7/20 主分类号 H05K7/20
代理机构 Heslin Rothenberg Farley & Mesiti, P.C. 代理人 Chiu, Esq. Steven;Radigan, Esq. Kevin P.;Heslin Rothenberg Farley & Mesiti, P.C.
主权项 1. A multi-rack assembly comprising: a first electronics rack, the first electronics rack comprising: at least one first rack electronic component to be cooled;at least one cooling unit disposed within the first electronics rack and coupled in fluid communication with a primary coolant loop in the first electronics rack to, at least in part, facilitate cooling of the at least one first rack electronic component of the first electronics rack, the at least one cooling unit providing cooled coolant to the primary coolant loop; and a second electronics rack, the second electronics rack comprising: a secondary coolant loop, the secondary coolant loop being coupled in fluid communication with the at least one cooling unit disposed within the first electronics rack, wherein the at least one cooling unit disposed within the first electronics rack provides cooled coolant to the secondary coolant loop to, at least in part, facilitate extracting heat generated within the second electronics rack; and a controller to automatically control flow of cooled coolant from the at least one cooling unit in the first electronic rack to the secondary coolant loop of the second electronics rack depending, at least in part, on cooling requirements of the first electronics rack.
地址 Armonk NY US
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