Pillar design for conductive bump

摘要

A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.

主权项

1. A semiconductor device comprising:
a first substrate; and a conductive post extending away from the first substrate, the conductive post comprising one or more trenches located along a sidewall of the conductive post, the one or more trenches being perpendicular to the first substrate.