MEMS component and a semiconductor component in a common housing having at least one access opening

摘要

A component includes at least one MEMS component and at least one additional semiconductor component in a common housing having at least one access opening. On the front side of the MEMS component, at least one diaphragm structure is provided, which spans a cavity on the backside of the MEMS component. The housing includes a carrier, on which the MEMS component is mounted. The MEMS component is mounted, using its front side, on the carrier, so that there is a standoff between the diaphragm structure and the carrier surface. The at least one additional semiconductor component is connected to the backside of the MEMS component, so that the MEMS component and the semiconductor component form a chip stack.

主权项

1. A component comprising:
at least one MEMS microphone component having at least one diaphragm structure developed on the front side, which spans a backside cavity; at least one additional semiconductor component (i) situated over the backside cavity of the MEMS microphone component and (ii) connected, at least in the edge region of the backside cavity, to the backside of the MEMS microphone component in a pressure-tight manner, such that the MEMS component and the semiconductor component form a chip stack; a carrier, on which the MEMS microphone component is mounted using its front side, so that there is a standoff between the diaphragm structure and the carrier; a cover part which is connected circumferentially to the carrier in a pressure-tight manner, and together with the carrier forms a housing having at least one sound opening for the MEMS microphone component and the additional semiconductor component; wherein: the at least one semiconductor component has a straight through hole to the cavity on the backside of the MEMS microphone component; the sound opening of the housing is provided in the cover part of the housing and is connected in a pressure-tight manner to the straight through hole in the at least one semiconductor component, so that the backside cavity of the MEMS microphone functions as the front volume of the MEMS microphone component; and the MEMS microphone component is mounted on the carrier in such a way that a housing cavity between the carrier and the cover part functions as the backside volume of the MEMS microphone component.