发明名称 Method and structure for forming fin resistors
摘要 A fin resistor and method of fabrication are disclosed. The fin resistor comprises a plurality of fins arranged in a linear pattern with an alternating pattern of epitaxial regions. An anneal diffuses dopants from the epitaxial regions into the fins. Contacts are connected to endpoint epitaxial regions to allow the resistor to be connected to more complex integrated circuits.
申请公布号 US8816436(B2) 申请公布日期 2014.08.26
申请号 US201213472605 申请日期 2012.05.16
申请人 International Business Machines Corporation 发明人 Cheng Kangguo;Adam Thomas N.;Khakifirooz Ali;Reznicek Alexander
分类号 H01L27/12;H01L23/62;H01L29/00;H01L27/06;H01L21/02 主分类号 H01L27/12
代理机构 代理人 Abate Joseph P.;Cohn Howard M.
主权项 1. A fin resistor, comprising: a plurality of epitaxial semiconductor regions disposed on a substrate in series with a plurality of fins, arranged in an alternating pattern of epitaxial semiconductor regions and fins; wherein a first epitaxial semiconductor region from the plurality of epitaxial semiconductor regions forms a first endpoint and a second epitaxial semiconductor region from the plurality of epitaxial semiconductor regions forms a second endpoint for the alternating pattern; wherein each of the plurality of epitaxial semiconductor regions has a first resistance and each of the plurality of fins has a second resistance, wherein the first resistance is different than the second resistance; wherein the plurality of epitaxial semiconductor regions have a dopant concentration ranging from about 1E20 atoms per cubic centimeter to about 2E21 atoms per cubic centimeter; and wherein the plurality of fins have a non-uniform dopant concentration profile, wherein a dopant concentration in an outer portion of each fin is higher than a dopant concentration in an interior portion of each fin.
地址 Armonk NY US