发明名称 Semiconductor apparatus with thin semiconductor film
摘要 A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.
申请公布号 US8816384(B2) 申请公布日期 2014.08.26
申请号 US201313861873 申请日期 2013.04.12
申请人 Oki Data Corporation 发明人 Ogihara Mitsuhiko;Fujiwara Hiroyuki;Sakuta Masaaki;Abiko Ichimatsu
分类号 H01L33/00;H01L27/15;G03G15/043;B41J2/45;H01L33/62 主分类号 H01L33/00
代理机构 Rabin & Berdo, P.C. 代理人 Rabin & Berdo, P.C.
主权项 1. A semiconductor apparatus comprising: a Si substrate having an integrated circuit formed therein, having a plurality of terminals electrically connected to the integrated circuit, and having a planarized surface; a plurality of thin semiconductor films being made of compound semiconductor material and including a plurality of light-emitting semiconductor devices respectively so that each of the plurality of thin semiconductor films includes a single light-emitting semiconductor device that is one of the plurality of light-emitting semiconductor devices, the plurality of thin semiconductor films being disposed on the planarized surface of the Si substrate, under surfaces of the plurality of thin semiconductor films, which face the Si substrate, being closely bonded to the planarized surface of the Si substrate, a width of each of the plurality of thin semiconductor films being less than 300 micrometers; and a plurality of individual interconnecting lines formed as thin conductive films extending from upper surfaces of the plurality of light-emitting semiconductor devices on the plurality of thin semiconductor films to the plurality of terminals on the Si substrate, thereby electrically connecting the plurality of light-emitting semiconductor devices to the plurality of terminals, respectively; wherein the plurality of thin semiconductor films are disposed in an array on the Si substrate.
地址 Tokyo JP