发明名称 |
Well region formation method and semiconductor base |
摘要 |
A well region formation method and a semiconductor base in the field of semiconductor technology are provided. A method comprises: forming isolation regions in a semiconductor substrate to isolate active regions; selecting at least one of the active regions, and forming a first well region in the selected active region; forming a mask to cover the selected active region, and etching the rest of the active regions, so as to form grooves; and growing a semiconductor material by epitaxy to fill the grooves. Another method comprises: forming isolation regions in a semiconductor substrate for isolating active regions; forming well regions in the active regions; etching the active regions to form grooves, such that the grooves have a depth less than or equal to a depth of the well regions; and growing a semiconductor material by epitaxy to fill the grooves. |
申请公布号 |
US8815698(B2) |
申请公布日期 |
2014.08.26 |
申请号 |
US201113381636 |
申请日期 |
2011.07.26 |
申请人 |
Institute of Microelectronics, Chinese Academy of Sciences |
发明人 |
Yin Haizhou;Zhu Huilong;Luo Zhijiong |
分类号 |
H01L27/04;H01L21/76;H01L21/8238;H01L29/16;H01L21/8234;H01L29/66 |
主分类号 |
H01L27/04 |
代理机构 |
Goodwin Procter LLP |
代理人 |
Goodwin Procter LLP |
主权项 |
1. A well region formation method, comprising:
forming isolation regions in a semiconductor substrate to isolate active regions; selecting at least one of the active regions, and forming a first well region in the selected active region, wherein the well region formation method further comprises: forming a mask to cover the selected active region, and etching the rest of the active regions, so as to form grooves; and growing a semiconductor material by epitaxy to fill the grooves. |
地址 |
Beijing CN |