发明名称 Well region formation method and semiconductor base
摘要 A well region formation method and a semiconductor base in the field of semiconductor technology are provided. A method comprises: forming isolation regions in a semiconductor substrate to isolate active regions; selecting at least one of the active regions, and forming a first well region in the selected active region; forming a mask to cover the selected active region, and etching the rest of the active regions, so as to form grooves; and growing a semiconductor material by epitaxy to fill the grooves. Another method comprises: forming isolation regions in a semiconductor substrate for isolating active regions; forming well regions in the active regions; etching the active regions to form grooves, such that the grooves have a depth less than or equal to a depth of the well regions; and growing a semiconductor material by epitaxy to fill the grooves.
申请公布号 US8815698(B2) 申请公布日期 2014.08.26
申请号 US201113381636 申请日期 2011.07.26
申请人 Institute of Microelectronics, Chinese Academy of Sciences 发明人 Yin Haizhou;Zhu Huilong;Luo Zhijiong
分类号 H01L27/04;H01L21/76;H01L21/8238;H01L29/16;H01L21/8234;H01L29/66 主分类号 H01L27/04
代理机构 Goodwin Procter LLP 代理人 Goodwin Procter LLP
主权项 1. A well region formation method, comprising: forming isolation regions in a semiconductor substrate to isolate active regions; selecting at least one of the active regions, and forming a first well region in the selected active region, wherein the well region formation method further comprises: forming a mask to cover the selected active region, and etching the rest of the active regions, so as to form grooves; and growing a semiconductor material by epitaxy to fill the grooves.
地址 Beijing CN