Sensor and method of manufacture thereof

摘要

A pressure sensor having a structure, which includes a supporting body, a circuit arrangement and at least one circuit support. The circuit arrangement includes circuit components, amongst which detection means for generating electrical signals representing a quantity to be detected. The at least one circuit support is connected to the supporting body and has a surface, formed on which is a plurality of said circuit components, amongst which electrically conductive paths, where the circuit support is laminated on the first face of the supporting body.

主权项

1. A method for the production of a plurality of sensors, in particular pressure sensors, comprising the operations of:
i) providing a plurality of supporting bodies; ii) providing a plurality of circuit arrangements, each circuit arrangement comprising circuit components, amongst which detection means for generating electrical signals representing a quantity to be detected; iii) providing a plurality of circuit supports, each having a surface formed on which is a plurality of said circuit components, amongst which electrically conductive paths, and iv) connecting each circuit support to a respective supporting body, wherein:
operation i) comprises the step of a) forming each of said supporting bodies with a cavity and defining in the supporting bodies, at a respective first face, a non-deformable peripheral portion and a central elastically deformable membrane portion which closes said cavity at an end thereof;
operations ii) and iii) comprise the steps of b) providing a tape made of electrically insulating material, in particular a dielectric material; c) depositing, on a length of the tape, one or more materials necessary for formation of a plurality of circuit patterns, each including a plurality of said circuit components; d) subjecting to drying the length of tape bearing the plurality of circuit patterns; e) subjecting the length of the tape to singulation, namely to removal from the length itself of individual subportions thereof, each including a respective circuit pattern, each subportion forming one said circuit support;
operation iv) comprises the step of: f) fixing via lamination each circuit support on the first face of a corresponding supporting body, in particular via a hot lamination, or a compression, with subsequent baking, in such a way that a region of the circuit support is superimposed to the membrane portion of the respective supporting body, said region including some of said circuit components.