发明名称 |
Printed circuit board and battery pack using the same |
摘要 |
A printed circuit board includes a base substrate, at least one through-hole in the base substrate, a connection tab extending through the through-hole, an electrical element on the base substrate and adjacent to the through-hole, and at least one groove portion in the base substrate and adjacent to the electrical element. |
申请公布号 |
US8815421(B2) |
申请公布日期 |
2014.08.26 |
申请号 |
US201113137790 |
申请日期 |
2011.09.13 |
申请人 |
Samsung SDI Co., Ltd. |
发明人 |
Park Jin-Sung |
分类号 |
H01M10/42 |
主分类号 |
H01M10/42 |
代理机构 |
Lee & Morse, P.C. |
代理人 |
Lee & Morse, P.C. |
主权项 |
1. A printed circuit board, comprising:
a base substrate including a first outer surface and a second outer surface defining a thickness of the base substrate; at least one through-hole in the base substrate, the through-hole extending to and open to the second outer surface; a connection tab extending through the through-hole; an electrical element on the base substrate and adjacent to the through-hole; and at least one groove portion including a bottom surface in the base substrate, extending from the bottom surface to the first outer surface to define a depth, open to the first outer surface, and adjacent to the electrical element, the electrical element being on the bottom surface, the groove portion being continuous along an entire circumference of the through-hole, and the depth of the at least one groove being less than the thickness of the base substrate. |
地址 |
Yongin-si, Gyeonggi-do KR |