Anisotropic conductive adhesive

摘要

An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 μm, a thickness of 0.5 to 2 μm, and an aspect ratio of 5 to 50, is used as the conductive particles. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %. This anisotropic conductive adhesive is supplied to a connection terminal of a wiring board, and a connection terminal of an electronic component is preliminarily connected to a connection terminal of a substrate while arranging the anisotropic conductive adhesive therebetween. Then, the electronic component is heated without applying a pressure or while applying a low pressure to the electronic component to connect the substrate with the electronic component.

主权项

1. An anisotropic conductive connection method comprising:
supplying an anisotropic conductive adhesive to a connection terminal of a wiring board; preliminarily connecting a connection terminal of an electronic component to the connection terminal of the wiring board while arranging the anisotropic conductive adhesive therebetween; and heating the electronic component while applying a pressure of 1 MPa or less to the electronic component to connect the wiring board with the electronic component and to completely or almost completely cure the adhesive; wherein the adhesive comprises: a binder resin composition and conductive particles that include a metal flake powder and are dispersed in the binder resin composition, wherein:
the metal flake powder enables electrical connection between the connection terminals and the conductive particles due to surface connection;the metal flake powder has a major axis of 10 to 40 μm, a thickness of 0.5 to 2 μm, and an aspect ratio of 5 to 50; andan amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %.