Method of manufacturing a fully integrated and encapsulated micro-fabricated vacuum diode

摘要

Disclosed is an encapsulated micro-diode and a method for producing same. The method comprises forming a plurality columns in the substrate with a respective tip disposed at a first end of the column, the tip defining a cathode of the diode; disposing a sacrificial oxide layer on the substrate, plurality of columns and respective tips; forming respective trenches in the sacrificial oxide layer around the columns; forming an opening in the sacrificial oxide layer to expose a portion of the tips; depositing a conductive material in of the opening and on a surface of the substrate to form an anode of the diode; and removing the sacrificial oxide layer.

主权项

1. A method for producing an encapsulated micro diode in a substrate, the method comprising:
forming a plurality of columns in the substrate with a respective tip disposed at a first end of the column, the tip defining a cathode of the diode; disposing a sacrificial oxide layer on the substrate, the plurality of columns, and the respective tips; forming respective trenches in the sacrificial oxide layer around the columns; depositing a dielectric material in the trenches and on top of the sacrificial oxide layer; forming an opening in the dielectric material, wherein the resultant opening extends into the sacrificial oxide layer but not so far as to expose a portion of the tips; depositing a conductive material in the opening to form an anode of the diode; removing the sacrificial oxide layer or a portion thereof; and depositing an encapsulation layer on a surface of the dielectric and a surface of the anode, thereby forming the encapsulated micro diode in the substrate.