Electronic component testing device and electronic component transport method

摘要

An electronic component testing device includes a first imaging device for imaging an upper-surface electrode of an electronic component before the electronic component is held by a holding part, a second imaging device for imaging a contact terminal provided to a testing head, a third imaging device for imaging a lower-surface electrode of the electronic component held by the holding part, and a fourth imaging device for imaging a testing socket. A control device controls the position adjustment part of the testing head to adjust the position of the holding part, and thereby controlling, based on images captured by the first and second imaging devices, a holding orientation when the holding part holds the electronic component, and controlling, based on the images captured by the third and fourth imaging devices, a holding orientation of the holding part in relation to the testing socket.

主权项

1. An electronic component testing device, comprising:
a testing socket configured and arranged to receive an electronic component therein when the electronic component is to be electrically tested, the electronic component having a first-surface electrode on a first surface and a second-surface electrode on a second surface opposite from the first surface; a testing head configured and arranged to transport and arrange the electronic component in the testing socket, the testing head having
a holding part configured and arranged to hold the electronic component,a position adjustment part configured and arranged to adjust a position of the holding part, anda contact terminal that is provided to the holding part and is configured and arranged to make contact with the first-surface electrode of the electronic component held by the holding part; a first imaging device configured and arranged to capture an image of the first-surface electrode of the electronic component before the electronic component is held by the holding part; a second imaging device configured and arranged to capture an image of the contact terminal provided to the testing head; a third imaging device configured and arranged to capture an image of the second-surface electrode of the electronic component held by the holding part; a fourth imaging device configured and arranged to capture an image of the testing socket; and a control device configured to control the position adjustment part of the testing head to adjust the position of the holding part so that
a holding orientation when the holding part holds the electronic component is controlled based on the images captured by the first and second imaging devices, anda holding orientation, with respect to the testing socket, of the holding part holding the electronic component is controlled based on the images captured by the third and fourth imaging devices.