发明名称 Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device
摘要 A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufactured by such a method is provided. A light-emitting device having high productivity and high reliability and a manufacturing method thereof are provided. A heat generation layer containing a conductive material which generates heat by induction heating is formed to overlap with a region where a paste including a frit material and a binder is applied. Alternatively, a conductive material which generates heat by induction heating is added to the paste itself. The paste is locally heated by induction heating to remove the binder included in the paste.
申请公布号 US8816336(B2) 申请公布日期 2014.08.26
申请号 US201213523435 申请日期 2012.06.14
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Shimomura Akihisa
分类号 H01L29/08 主分类号 H01L29/08
代理机构 Husch Blackwell LLP 代理人 Husch Blackwell LLP
主权项 1. A method for manufacturing a sealed body, comprising the steps of: forming a heat generation layer over a first substrate; forming a frit paste comprising a frit material and a binder over the heat generation layer; heating the heat generation layer by induction heating to remove the binder and to fuse the frit material so that a glass frit is formed; arranging the first substrate and a second substrate to interpose the glass frit therebetween; and irradiating the glass frit with laser light to bond the glass frit to the second substrate.
地址 JP