发明名称 |
Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device |
摘要 |
A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufactured by such a method is provided. A light-emitting device having high productivity and high reliability and a manufacturing method thereof are provided. A heat generation layer containing a conductive material which generates heat by induction heating is formed to overlap with a region where a paste including a frit material and a binder is applied. Alternatively, a conductive material which generates heat by induction heating is added to the paste itself. The paste is locally heated by induction heating to remove the binder included in the paste. |
申请公布号 |
US8816336(B2) |
申请公布日期 |
2014.08.26 |
申请号 |
US201213523435 |
申请日期 |
2012.06.14 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
Shimomura Akihisa |
分类号 |
H01L29/08 |
主分类号 |
H01L29/08 |
代理机构 |
Husch Blackwell LLP |
代理人 |
Husch Blackwell LLP |
主权项 |
1. A method for manufacturing a sealed body, comprising the steps of:
forming a heat generation layer over a first substrate; forming a frit paste comprising a frit material and a binder over the heat generation layer; heating the heat generation layer by induction heating to remove the binder and to fuse the frit material so that a glass frit is formed; arranging the first substrate and a second substrate to interpose the glass frit therebetween; and irradiating the glass frit with laser light to bond the glass frit to the second substrate. |
地址 |
JP |