| 摘要 |
The invention provides a printed circuit board and manufacturing method thereof. The manufacturing method of the printed circuit board comprises the steps of forming a predetermined pattern circuit on a preparative base plate; processing a dummy cavity in a dummy area which is the portion except the predetermined pattern circuit portion on the base plate; manufacturing a dummy strengthening portion as an anti-warping material used for preventing the base plate from warping; processing a circuit portion cavity which corresponds to the predetermined pattern circuit portion formed on the base plate in the dummy strengthening portion, coupling the dummy strengthening portion process with the circuit portion cavity to the base plate processed with the dummy cavity; forming insulating layers used for protecting the circuit and the dummy strengthening portion on the upper surface and the lower surface of the base plate coupled with the dummy strengthening portion in order to complete the manufacture of the printed circuit board. |
