Liquid cooling system for modular electronic systems

摘要

A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The cooling body is cooled by introducing a fluid therein via an input conduit. The hot fluid is received from the cooling body by an output conduit and is cooled for recycling. The housing of the electronic device includes a rearward gap that admits the cooling body into the housing of the electronic device. Preferably, further cooling is provided by forcing a gas to flow past the output conduit.

主权项

1. A system for cooling an integrated circuit of an electronic device, comprising:
(a) a cooling body; (b) a shelf, positioned relative to said cooling body for reversible insertion of the electronic device onto said shelf such that upon said reversible insertion, said cooling body comes into thermal contact with the integrated circuit, and such that said shelf keeps the integrated circuit in said thermal contact with said cooling body while the electronic device remains inserted onto said shelf; (c) an input conduit, in fluid communication with said cooling body, for introducing a fluid into said cooling body; and (d) an output conduit, in fluid communication with said cooling body, for receiving said fluid from said cooling body;wherein said shelf is a sole component of the system that keeps the integrated circuit in said thermal contact with said cooling body.