发明名称 Emissivity profile control for thermal uniformity
摘要 A substrate for processing in a heating system is disclosed. The substrate includes a bottom portion for absorbing heat from a radiating heat source, the bottom portion having a first region having a first emissivity and a second region having a second emissivity less than the first emissivity. The first region and the second region promote thermal uniformity of the substrate by compensating for thermal non-uniformity of the radiating heat source.
申请公布号 US8815012(B2) 申请公布日期 2014.08.26
申请号 US201313738272 申请日期 2013.01.10
申请人 Intermolecular, Inc. 发明人 Kelekar Rajesh
分类号 H05B6/10;H01L21/67;H01L21/687;H01L21/02;H01L21/324 主分类号 H05B6/10
代理机构 代理人
主权项 1. A method for heating a substrate, the method comprising: disposing a substrate above a radiant heat source, wherein a bottom surface of the substrate faces a top surface of the radiant heat source; heating the radiant heat source, wherein the top surface of the radiant heat source has a non-uniform temperature distribution when heated, wherein a temperature of the top surface of the radiant heat source varies as a function of a radius of the radiant heat source by more than 300K; and transferring heat from the radiant heat source to the substrate in a uniform manner across the bottom surface of the substrate, wherein the uniform heat transfer is achieved by having a variable emissivity profile across the bottom surface of the substrate, the variable emissivity profile corresponding to a variable emissivity of the bottom surface of the substrate, a variable emissivity of the top surface of the radiant heat source, or a combination of the variable emissivity of the bottom surface of the substrate and the variable emissivity of the top surface of the radiant heat source.
地址 San Jose CA US