Integrated circuit packaging system with formed under-fill and method of manufacture thereof

摘要

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit above the substrate with an interconnect directly connecting between the substrate and the integrated circuit; and forming an under-fill between the integrated circuit and the substrate having a cast side.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate; forming a flow restrictor on the substrate; mounting an integrated circuit above the substrate and adjacent to the flow restrictor with an interconnect directly connecting between the substrate and the integrated circuit; and forming an under-fill between the integrated circuit and the substrate, the under-fill in direct contact with the flow restrictor; removing the flow restrictor for creating a cast side of the under-fill spaced away from a peripheral side of the integrated circuit and the cast side formed with the vertical and planar characteristics of having been in direct contact with the flow restrictor.