Substrate treatment method and substrate treatment apparatus

摘要

The substrate treatment method is for treating a substrate with a chemical liquid in a treatment chamber. The method includes a higher temperature chemical liquid supplying step, and a rinse liquid supplying step after the higher temperature chemical liquid supplying step. The rinse liquid supplying step includes: a peripheral edge portion treating step of supplying the rinse liquid selectively onto a center portion of the front surface of the substrate so that a chemical liquid treatment is inhibited on the center portion while being allowed to proceed on a peripheral edge portion of the front surface of the substrate; and an entire surface rinsing step of spreading the rinse liquid over the entire front surface of the substrate to replace the chemical liquid with the rinse liquid on the entire front surface of the substrate after the peripheral edge portion treating step.

主权项

1. A substrate treatment method for treating a substrate with a chemical liquid in a treatment chamber, the method comprising:
a higher temperature chemical liquid supplying step of supplying a higher temperature chemical liquid onto a front surface of the substrate, the higher temperature chemical liquid having a higher temperature than the treatment chamber; and a rinse liquid supplying step of supplying a rinse liquid onto the front surface of the substrate to rinse away the chemical liquid after the higher temperature chemical liquid supplying step; the rinse liquid supplying step including: a peripheral edge portion treating step of supplying the rinse liquid selectively onto a center portion of the front surface of the substrate so that a chemical liquid treatment is inhibited on the center portion while being allowed to proceed on a peripheral edge portion of the front surface of the substrate; and an entire surface rinsing step of spreading the rinse liquid over the entire front surface of the substrate to replace the chemical liquid with the rinse liquid on the entire front surface of the substrate after the peripheral edge portion treating step; further comprising: a chemical liquid treating/rotating step of rotating the substrate at a predetermined first rotation speed, the chemical liquid treating/rotating step being performed in parallel to the higher temperature chemical liquid supplying step, wherein the peripheral edge portion treating step includes a lower speed rotating step of rotating the substrate at a second rotation speed lower than the first rotation speed while supplying the rinse liquid onto the center portion of the front surface of the substrate; and wherein the peripheral edge portion treating step further includes a higher speed rotating step of rotating the substrate at a speed that is substantially equal to the first rotation speed, while supplying the rinse liquid onto the center portion of the front surface of the substrate, the higher speed rotating step being performed before the lower speed rotating step.