Device including two semiconductor chips and manufacturing thereof

摘要

A device includes a first semiconductor chip with a first contact pad on a first face and a second semiconductor chip with a first contact pad on a first face. The second semiconductor chip is placed over the first semiconductor chip, wherein the first face of the first semiconductor chip faces the first face of the second semiconductor chip. Exactly one layer of an electrically conductive material is arranged between the first semiconductor chip and the second semiconductor chip. The exactly one layer of an electrically conductive material electrically couples the first contact pad of the first semiconductor chip to the first contact pad of the second semiconductor chip.

主权项

1. A device, comprising:
a first semiconductor chip comprising a first contact pad on a first face; a second semiconductor chip comprising a first contact pad on a first face, wherein the second semiconductor chip is placed over the first semiconductor chip, the first face of the first semiconductor chip faces the first face of the second semiconductor chip, and the first contact pad on the first face of the first semiconductor chip is directly opposite the first contact pad on the first face of the second semiconductor chip; and exactly one layer of an electrically conductive material arranged between the first semiconductor chip and the second semiconductor chip, wherein
the exactly one layer of an electrically conductive material electrically couples the first contact pad of the first semiconductor chip to the first contact pad of the second semiconductor chip,a contour of the first contact pad of the first semiconductor chip defines a first section of the first face of the first semiconductor chip, andthe first section of the first semiconductor chip and the exactly one layer of an electrically conductive material each have a smaller area than then an area of the first face of the first semiconductor chip.