| 摘要 |
There is disclosed a method for adhering a first connecting portion comprising a first electrode formed on a transparent substrate and a second connecting portion comprising a second electrode formed on a flexible substrate, whereby electrically connecting the first electrode and the second electrode, the method comprising the steps of: applying a bonding composition on at least one of the first connecting portion and the second connecting portion; aligning the first electrode and the second electrode, and irradiating with light while the first connecting portion and the second connecting portion are pressed so as to contact each other; and allowing the resulting assembly to stand at ambient temperature after the light irradiation; wherein the bonding composition comprises no electrically-conductive particle, but comprises: (a) a curable resin component; (b) a photo cure initiation component; and (c) an anaerobic curing initiation component; and wherein the anaerobic curing is not completed when the photo-irradiation is terminated. |
