| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure capable of successfully bond electrodes each other even when an underfill is coated before bonding of the electrodes.SOLUTION: A semiconductor device 120 including a first semiconductor substrate 1 and a second semiconductor substrate 101 bonded to the first semiconductor substrate comprises an underfill layer 31 formed between the first semiconductor substrate and the second semiconductor substrate. The first semiconductor substrate has a recess 51 provided on one surface and a first electrode 52 arranged in the recess. The second semiconductor substrate has a second electrode 61 with a shape at least a part of which can proceed into the recess. The first electrode and the second electrode are connected by piercing of the second electrode into the first electrode through the underfill layer. |
