| 摘要 |
PROBLEM TO BE SOLVED: To relax concentration of stress on a solder, in a bracket for fixing a substrate having an electronic component soldered to the surface thereof to a case, while suppressing vibration of a substrate in the case. ! SOLUTION: Connections 30a-30j of a bracket 20 are formed as thin leaf springs having an elastic modulus capable of relaxing a stress generated by thermal expansion of a case and thermal expansion of a substrate in a temperature range used normally, so that the leaf springs bend in a predetermined shape in a direction on the inside of the case at a predetermined temperature, and the thickness Dv in a direction substantially perpendicular to the surface of the substrate is thicker than the thickness Dp in a direction substantially parallel with the surface of the substrate. Consequently, concentration of stress on the solder is relaxed, and vibration of the substrate can be suppressed. ! COPYRIGHT: (C)2014,JPO&INPIT |
