COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a composite substrate suitable for efficiently manufacturing a high-quality semiconductor wafer in good yield and a method for manufacturing a semiconductor wafer using the same.SOLUTION: A composite substrate 1 includes a support substrate 11 including a mullite phase of not less than 35 mass% and not more than 65 mass% and an alumina phase of not less than 35 mass% and not more than 65 mass% as a crystal phase and a semiconductor film 13 arranged on a principal surface 11m side of the support substrate 11. A method for manufacturing a semiconductor wafer 3 includes the steps of: preparing the composite substrate 1; forming a composite substrate 2 with a semiconductor layer by growing at least one semiconductor layer 20 on the semiconductor film 13 of the composite substrate 1; and forming a semiconductor wafer 3 by removing the support substrate 11 from the composite substrate 2 with the semiconductor layer.