发明名称 ELECTRONIC COMPONENT MOUNTING HEAD AND ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting head capable of accurately and stably change an array pitch of suction nozzles in a simple configuration.SOLUTION: In an electronic component mounting head 1, a sub frame 7 and a main frame 8 are provided in parallel with each other while supporting suction nozzles 20 in a vertically movable and rotatable manner. The sub frame 7 is a movable frame which is movable in a Y direction to change a distance between the two frames. In any one of or both the frames, a plurality of suction nozzles are mutually disposed at predetermined array pitches via a gap T. With movement of the sub frame, the suction nozzles supported by the opposing frame can be inserted into the gap T. By moving the sub frame, the suction nozzles can be changed between a parallel state where the suction nozzles supported by the sub frame and the suction nozzles supported by the main frame are disposed in parallel, and a serial state where the suction nozzles are disposed in series.
申请公布号 JP2014154791(A) 申请公布日期 2014.08.25
申请号 JP20130025067 申请日期 2013.02.13
申请人 JUKI CORP 发明人 KAWAKUBO YU
分类号 H05K13/04 主分类号 H05K13/04
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