| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polyimide (PI) having improved physical characteristics (above all chemical resistance and excellent thermal characteristics, e.g., low CTE).SOLUTION: The provided polyimide (PI) possesses two -COOH capping groups at each terminal thereof. A coating composition including the PI and a curative possessing 2 to 6 functional groups reactive with -COOH is also provided. A PI coating layer and a PI thin film formed from the coating composition of the present invention are each endowed with excellent chemical resistance and coefficient of thermal expansion (CTE). The PI coating layer and PI thin film can be applied for manufacturing a protective material for an active/passive device, optical material, touch panel, copper foil substrate, flexible electronic material or integrated circuit element, or a thin film substrate for a thin glass film touch panel.</p> |
