VAPOR DEPOSITION MATERIAL, GAS BARRIER VAPOR DEPOSITION FILM AND METHOD FOR MANUFACTURING GAS BARRIER VAPOR DEPOSITION FILM

摘要

PROBLEM TO BE SOLVED: To provide a vapor deposition material capable of suppressing occurrence of a splash phenomenon and obtaining high gas barrier.SOLUTION: A gas barrier vapor deposition film 10 has a vapor deposition film 12 formed on one surface of a polymer film substrate 11 by depositing a vapor deposition material including either or both of a metal silicon powder and a silicon dioxide powder and either or both of a metal tin powder and a tin oxide powder using a heating type vacuum vapor deposition apparatus. A ratio (O/(Si+Sn)) of the number of oxygen (O) atoms to the total number of silicon (Si) atoms and tin (Sn) atoms in the vapor deposition film 12 vapor-deposited on the polymer film substrate 11 is 1.0-2.0, and a ratio (Sn/Si) of the number of the tin (Sn) atoms to that of silicon (Si) atoms is 0.03-0.15.