| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for protecting an insulating plate held between a semiconductor card and a cooling plate from damage regarding a lamination unit in which the semiconductor cards and the cooling plates are alternately laminated and the laminate is energized and adhered in a direction of lamination.SOLUTION: In a lamination unit 100, a semiconductor card 6 and a flat cooling plate 2 are laminated with an insulating plate 4 interposed therebetween and a load is received from both sides in a direction of lamination. In the semiconductor card 6, a semiconductor device is encapsulated in a plate-like resin mold body 3. On a surface of the mold body 3 opposing the insulating plate 4, a heat sink 5 is exposed to be flush with the surface of the mold body 3 while being surrounded by the mold body 3 in a view from the direction of lamination. On a surface of the cooling plate 2 opposing the insulating plate 4, a recess 2a is provided. The insulating plate 4 and the mold body 3 are disposed to be overlapped with an edge 2b of the recess 2a in a view from the direction of lamination. |
