| 摘要 |
PROBLEM TO BE SOLVED: To provide an alignment mark for exposure for a printed wiring board for improving yield in a manufacture process of a printed wiring board by accomplishing a printed wiring board capable of reducing the amount of positional displacement between an inner via hole filled with conductive paste and a conductor circuit, and a manufacturing method of the printed circuit board.SOLUTION: An inner via hole 6 for position recognition for exposure alignment is formed by filling a through hole which is worked on a prepreg sheet 1, with conductive paste 7. A copper clad lamination plate is formed by overlapping a roughened copper foil 8 to the outside of the prepreg sheet 1 and heating/pressurizing them. In a step of forming a conductor circuit by aligning the heated/pressurized inner via hole 6 for exposure alignment position recognition formed by being filled with the conductive paste with a criterion, a position recognition mark 18 having surface glossiness difference of the roughened copper foil 8 is used for position recognition. |
