发明名称 WOODEN HEAT INSULATION PANEL
摘要 PROBLEM TO BE SOLVED: To improve heat insulation property of a wooden heat insulation panel using a wooden frame.SOLUTION: The inside of a wooden frame 12 of a wooden heat insulation door 10 is partitioned into a plurality of spaces 14 by muntins 12C cross rails 12D. A heat insulation board 16 is incorporated in each of the spaces 14. The heat insulation board 16 has an overall heat transfer coefficient (U-value) lower than that of the wooden frame 12. For a clearance between the wooden frame 12 and the heat insulation board 16, airtight tapes 18A, 18B for closing the clearance are provided from both surface sides of the wooden frame 12. Furthermore, sound insulation sheets 20A, 20B and decorative wooden plates 22A, 22B are provided on both surfaces of the wooden frame 12 provided with the heat insulation board 16 and the airtight tapes 18A, 18B. A door with lower overall heat transfer coefficient can be obtained by enhancing airtightness of the inner structure of the door. Meanwhile, dew condensation is prevented by providing decorative wooden plates 22A, 22B on surfaces of the door.
申请公布号 JP2014152561(A) 申请公布日期 2014.08.25
申请号 JP20130025023 申请日期 2013.02.12
申请人 KATO SADAHIRO;NONAKA AKIRA 发明人 KATO SADAHIRO;NONAKA AKIRA
分类号 E04B1/80 主分类号 E04B1/80
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