RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition having higher level adhesion while maintaining excellent dielectric properties of PPE and properties such as heat resistance of a cured substance.SOLUTION: The resin composition comprises: a reaction product including a polyphenylene ether (A) having 1.5-2 of an average number of hydroxyl groups in one molecule and an epoxy compound (B) having 2-2.3 of an average number of epoxy groups in one molecule and obtained by previously reacting at least a part of hydroxyl groups of the polyphenylene ether (A) with epoxy groups of the epoxy compound (B) so that a concentration of terminal hydroxyl groups of the polyphenylene ether (A) is 700 μmol/g or less; a cyanate ester compound (C); and an organic metal salt (D).