| 摘要 |
A semiconductor manufacturing apparatus for bevel etching is provided to improve throughput by performing a bevel etching process of a plurality of wafers in one bevel etching chamber at the same time. A plurality of wafers is loaded in a wafer buffer of a first load-lock chamber(106) and a second load-lock chamber(108). A transfer module(110) transfers a plurality of wafers to a first to a third bevel etching chambers(112,114,116) or the first to the second load-lock chambers at the same time. A vacuum robot(109) is mounted in the transfer module. The vacuum robot includes a pair of first forks, a pair of second forks, a first robot arm, a second robot arm, and a robot arm driving part. The first robot arm is coupled in a pair of first forks. The second robot arm is coupled in a pair of second forks. The robot arm driving part controls extension and contraction of the first robot arm and the second robot arm. |
