| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive substance forming apparatus capable of collectively processing a plurality of substrates and forming a conductive substance in micropores provided in the substrate so as to uniformly deposit the conductive substance in the micropores with uniform thickness.SOLUTION: In an apparatus for forming a conductive substance in micropores, a fluid which is formed by dissolving at least a metal complex in a supercritical fluid or a subcritical fluid, is led into a reaction vessel, a plurality of plate-like substrates are disposed and the conductive substance is formed on inner walls of micropores provided in each of the substrates. The reaction vessel includes a first space into which the fluid is led, and a second space from which the fluid is led out, and supports another surface of the substrate as a whole in such a manner that the fluid moves forwards inside of the micropores of the substrate. A support member is disposed in which fine communication holes are present for passing the fluid to the second space. On one surface of the support member in contact with the other surface of the substrate, the substrates are disposed while being separated from each other and in the separated portion, one surface of the support member is exposed in the first space. At the side of another surface of the support member, one opening is disposed in the second space for each support member. |
