RESIN COMPOSITION FOR THIN FILM, THIN FILM, LAMINATED SHEET, AND MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a technology capable of achieving an insulating layer which has s small surface roughness after roughening and exhibits sufficient peeling strength to a conductor layer, even when a thin insulating layer is formed.SOLUTION: A resin composition for a thin film contains (A) an epoxy resin, (B) a curing agent, and (C) a thermoplastic resin. A mass ratio of (C) the thermoplastic resin/(A) the epoxy resin is 0.5-40. A mass ratio of (C) the thermoplastic resin/[(A) the epoxy resin+(B) the curing agent] is 0.1-20.