| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module substrate which reduces a residual void in a solder layer when joining a semiconductor device.SOLUTION: A power module substrate 10 comprises one or more copper plates which are joined to both principal surfaces of a ceramic substrate 11 by heating according to a direct junction method or an active metal brazing filler material junction method and of which the regions are independent, respectively. The power module substrate 10 further comprises: an overlay part 16 which protrudes on a mount copper plate 15 for placing a semiconductor device 14 thereon, among the copper plates smaller than a size of the semiconductor device 14 while flattening the top face thereof, for placing the semiconductor device 14 thereon; a groove-like or a hole-like recess 17 which is formed on the top face of the overlay part 16 with a depth equal to or less than a thickness of the overlay part 16; and a notch 18 extending to an outer edge of the overlay part 16 while communicating to the recess 17. |
